3D AOI rendgenski snimakGÖPEL
X Line 3D AOI/AXI
3D AOI rendgenski snimak
GÖPEL
X Line 3D AOI/AXI
godina proizvodnje
2016
Stanje
Polovno
Lokacija
Braak 

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Podaci o mašini
- Naziv mašine:
- 3D AOI rendgenski snimak
- proizvođač:
- GÖPEL
- Model:
- X Line 3D AOI/AXI
- godina proizvodnje:
- 2016
- Stanje:
- vrlo dobro (rabljeno)
Cijena i lokacija
- Lokacija:
- Matthäus-Berg-Ring 6, 22145 Braak, DE
Pozovite
Detalji ponude
- ID oglasa:
- A19283971
- ažuriranje:
- posljednji put 03.06.2025
Opis
Automatic X-ray inspection
For the inspection of BGA, QFN, THT, LED, LGA, and other solder joints, visible or hidden.
Hnsdpfx Ajwpuadea Rsu
Other:
Including offline station and repair station
OS: Windows 7
Ultra-high speed line-scan CCD detectors
Inspection area: 450 mm - 400 mm
Image capture: 2D, 2.5D, 3D (layer images with planar CT)
PCB dimensions: 60 - 450 x 50 - 400 mm
AXI resolution: 6 - 30 µm / px
AOI:
Camera field of view: 42 mm x 42 mm
Resolution: 21 µm
Inspection height: -3 to 7.5 mm
Optics: telecentric
Transport height: 950 mm +/- 25 mm
Interface: SMEMA
Width adjustment: automatic
Oglas je automatski preveden. Moguće su greške u prijevodu.
For the inspection of BGA, QFN, THT, LED, LGA, and other solder joints, visible or hidden.
Hnsdpfx Ajwpuadea Rsu
Other:
Including offline station and repair station
OS: Windows 7
Ultra-high speed line-scan CCD detectors
Inspection area: 450 mm - 400 mm
Image capture: 2D, 2.5D, 3D (layer images with planar CT)
PCB dimensions: 60 - 450 x 50 - 400 mm
AXI resolution: 6 - 30 µm / px
AOI:
Camera field of view: 42 mm x 42 mm
Resolution: 21 µm
Inspection height: -3 to 7.5 mm
Optics: telecentric
Transport height: 950 mm +/- 25 mm
Interface: SMEMA
Width adjustment: automatic
Oglas je automatski preveden. Moguće su greške u prijevodu.
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