Postrojenje za mokru obradu wafer-a

Robotechnik Europe OPTIwet ST30

System for wet chemical processing of wafers up to 12in, substrates up to X/Y 9in/9in, stand-alone housing, process modules, PP process chamber, 2 programmable media arms, rotational speed 1-4000rpm, acceleration ramp 1-3000rpm, spin time 1-999s, exhaust process bowl 2x DN110, chamber 2x DN110, housing 1x DN110, control 1x DN110 (each approx. 200m³/h), CDA 8+/-2bar, vacuum -0.8+/-0.2bar, nitrogen 4.0+/-0.5bar, 3 media drains, waste box for 2 concentrate wastes, reagent box with pressure vessel, 4 Julabo thermostat baths. The system was dismantled during disassembly. Viewing possible by arrangement.
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