Inspekcija rendgenskim zračenjem

Seamark X-ray machine 5600

Model: X5600
Application: Micro-focus X-ray inspection of electronic components and assemblies such as BGA, CSP, SMT, wafer, SOP, QFN, sensors, and more.

X-ray Source

Specification Value
Type Sealed micro-focus X-ray tube
Voltage 40–90 kV
Current 10–200 µA
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Max. output power 8 W
Microfocus spot size 15 µm
X-ray leakage ≤ 0.5–≤ 1 μSv/h (safety standard)

Detector & Image Quality
Specification Value
Detector type TFT industrial dynamic flat panel detector
Resolution pixel matrix 768 × 768 (sometimes 1.3 MP depending on configuration)
Field of View 65 × 65 mm to ~130 × 130 mm
Image resolution ~5.8 Lp/mm
Frame rate ~20–40 fps
A/D conversion 16 bit

🛠️ Mechanical & System Specifications
Property Value
Machine dimensions approx. L850 × W1000 × H1700 mm
Max. sample size ~280 × 320 mm
Net weight approx. 750 kg
Power supply 220 V 10 A / 110 V 15 A 50–60 Hz
Operating system Industrial PC (Windows 7/10 64-bit)
Inspection mode CNC automatic multi-point inspection
Tilt function ± 30° tilt & 360° rotation for multi-angle inspection

Software & Features

✔ Automatic defect recognition: Y/N, crack, broken wire, offset, bridging, etc.
✔ CNC-controlled automatic inspection over multiple points.
✔ Infrared automatic navigation and positioning.
✔ Inspection report generation.
✔ Multi-angle & 360° rotation inspection for enhanced defect detection.

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